Underfilled Adhesive 5218/5219->adhesive

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Underfilled Adhesive 5218/5219

Category :

Chemicals->Others->adhesive

Product Specification

Model No:	5218/5219

Country	CN
Brand	Lianbond
Materials	Epoxy resin
Weight	30g 250g
Color	light yellao transparent
Packing	30ml 250g
Minimum Order	50kg
Payment Term	T/T

Product Detail

Lianbond 5218 underfilled Adhesive
Belonging to a single component of fast curing epoxy filler.
Typical useing:
Mainly for the protection after filling the CSP; BGA and UBGA .
For example: mobile phones, laptop computers and so on.
Characteristics before curing:
Basal chemical material composition:Epoxy resin.
Outlooks: Light yellow transparent liquid.
Repair and cleaning :
Have a repairance when the mechanical defects , simply by heating the chip until the temperature reaches the solder melting,carefully twist element, destroyed the adhesive layer, take element with vacuum suction or tweezers and clean with brush and isopropanol cleaning, not excessive force.
Packaging specifications:
30ml / ( EFD )tube; 250ml/bottle:170g / barrel.

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Fast curing Adhesive


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